Power cycling of flip chip assemblies

This thesis demonstrates the feasibility of power cycling a "Flip Chip" assembly for reliability assessment. The assemblies studied were Si on Si Multi-Chip Modules (MCMs) that were mounted on either an organic FR4 or a metallic (copper) substrate. The aim of the work was to investigate ho...

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Bibliographic Details
Main Author: Andrew R. Ochana
Format: Default Thesis
Published: 2004
Subjects:
Mechanical engineering not elsewhere classified
Flip chip
Finite element analysis
Power cycling
Reliability
Multichip modules
Solder
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/12688
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