An analytical model of the microstructure in near-bamboo interconnects
We aim here to describe electromigration-induced interconnect failure using a one-dimensional microstructure model (already one-dimensional models are used for the stress evolution). One might expect such a model to be reasonably successful because either (i) line widths are well below grain-boundar...
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| Format: | Default Article |
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2004
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| Online Access: | https://hdl.handle.net/2134/9045 |
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