Magnetic deposition of Ni/Au coated polymer core particles for flip-chip interconnection

With the increasing demand for high-density interconnections, flip-chip packaging has become increasingly used in the electronics industry. Traditional solder bump based interconnects are however unable to meet the challenge of ultrafine pitch and very high I/O count integration. Consequently, alter...

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Bibliographic Details

Main Authors:	Junlei Tao, David Whalley, Changqing Liu
Format:	Default Conference proceeding
Published:	2014
Subjects:	Mechanical engineering not elsewhere classified Flip chip ACA Magnetic deposition Ni/Au coated Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/18414
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