Three dimensional printed electronic devices realised by selective laser melting of copper/high-density-polyethylene powder mixtures

A manufacturing process with the capability to integrate electronics into 3D structures is of great importance to the development of next-generation miniaturised devices. In this study, Selective Laser Melting (SLM) was used to process copper/high-density-polyethylene (HDPE) powder mixtures to build...

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Bibliographic Details

Main Authors:	Shuai Hou, Siyuan Qi, David Hutt, John Tyrer, Mulan Mu, Zuoxin Zhou
Format:	Default Article
Published:	2017
Subjects:	Mechanical engineering not elsewhere classified Selective laser melting Additive manufacturing HDPE Copper Resistivity 3D electronics Mechanical Engineering not elsewhere classified Mechanical Engineering
Online Access:	https://hdl.handle.net/2134/27926
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