Mechanisms of copper protrusion in through-silicon-via structures at the nanoscale

Thermal stress-induced copper protrusion is frequently observed in through-silicon-vias (TSVs) based three-dimensional (3D) system integration. In this study, the detailed process of Cu protrusion is reproduced on the atomic scale using a two-mode phase-field-crystal (PFC) model, and the mechanisms...

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Bibliographic Details
Main Authors: Jinxin Liu, Zhiheng Huang, Yong Zhang, Paul Conway
Format: Default Article
Published: 2018
Subjects:
Mechanical engineering not elsewhere classified
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Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/35406
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https://hdl.handle.net/2134/35406

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