Bidirectional electromigration failure

Pulsed bidirectional currents in copper interconnect can cause electromigration (EM) –induced cyclic void behaviour. Cycles of void nucleation, growth, shrinkage and healing may be seen in the time variation of a line’s resistance profile. In practice each cycle appears to create some net effect so...

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Bibliographic Details

Main Authors:	M.K. Lim, Vassilios Chouliaras, C.L. Gan, Vincent Dwyer
Format:	Default Article
Published:	2013
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/17818
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