Study of height reduction of Sn99Cu1/Cu solder joints as a result of isothermal aging

Sn99Cu1/Cu solder joints were investigated after isothermal aging at 175°C for different lengths of time under vacuum conditions. The results revealed height reduction of the solder of approximately 1.2 μm after aging for 1132.5 h. This was primarily attributed to growth of a layer of interfacial in...

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Bibliographic Details

Main Authors:	Zhiwen Chen, Changqing Liu, Yiping Wu, Bing An, Longzao Zhou
Format:	Default Article
Published:	2015
Subjects:	Mechanical engineering not elsewhere classified Lead-free solder Aging Intermetallic compounds Height reduction of solder joints Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/19452
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