Process and performance modelling for individual ACA conductor particles

Flip-chip assembly using anisotropic conductive adhesives (ACAs) has been successfully applied to the achievement of fine pitch electrical interconnections for certain niche applications, particularly flat panel displays. ACAs are an adhesive polymer containing a low volume fraction of conductive pa...

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Bibliographic Details

Main Authors:	Junlei Tao, David Whalley, Changqing Liu, J.Y. He
Format:	Default Conference proceeding
Published:	2014
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/18415
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