Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles

In this work, SAC305 lead-free solder reinforced with 0.1 wt. % fullerene nanoparticles was prepared using a powder metallurgy method. A lab-made setup and a corresponding Cu/solder/Cu sample for thermo-migration (TM) test were designed and implemented. The feasibility of this setup for TM stressing...

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Bibliographic Details

Main Authors:	Guang Chen, Li Liu, Juan Du, Vadim Silberschmidt, Y.C. Chan, Changqing Liu, Fengshun Wu
Format:	Default Article
Published:	2016
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/22918
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