Microstructure-based multiphysics modeling for semiconductor integration and packaging

Semiconductor technology and packaging is advancing rapidly toward system integration where the packaging is co-designed and co-manufactured along with the wafer fabrication. However, materials issues, in particular the mesoscale microstructure, have to date been excluded from the integrated product...

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Bibliographic Details

Main Authors:	Zhiheng Huang, Hua Xiong, Zhiyong Wu, Paul Conway, Hugh Davies, Alan Dinsdale, Yunfei En, Qingfeng Zeng
Format:	Default Article
Published:	2014
Subjects:	Mechanical engineering not elsewhere classified Materials Genome Initiative Semiconductor integration and packaging Microstructure Reliability Multiphysics modeling Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/16074
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