On reproducing the copper extrusion of through-silicon-vias from the atomic scale

Three-dimensional system integration with through-silicon-vias (TSVs) is regarded as a promising solution to the 'More-than-Moore' challenge to improve the performance of micro- and nano-electronic devices. However, the copper extrusion of TSVs during the back-end-of-the-line (BEOL) proces...

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Bibliographic Details

Main Authors:	Jinxin Liu, Zhiheng Huang, Paul Conway, Frank Altmann, Matthias Petzold, Falk Naumann
Format:	Default Conference proceeding
Published:	2017
Subjects:	Mechanical engineering not elsewhere classified Copper extrusion Through-silicon-via (TSV) Phase field crystal (PFC) model Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/28448
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