Huang, Z., & Conway, P. (2014). Quantitative characterisation of multi scale microstructures in interconnects for multi-chip stacking.
Chicago Style (17th ed.) CitationHuang, Zhiheng, and Paul Conway. Quantitative Characterisation of Multi Scale Microstructures in Interconnects for Multi-chip Stacking. 2014.
MLA (9th ed.) CitationHuang, Zhiheng, and Paul Conway. Quantitative Characterisation of Multi Scale Microstructures in Interconnects for Multi-chip Stacking. 2014.
Warning: These citations may not always be 100% accurate.