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Thermal and electrical modelling of polymer cored BGA interconnects
Polymer cored BGA/CSP balls have been proposed as a more reliable alternative to solid solder balls for demanding application environments. Their potential advantages are dependant on their increased compliance compared with a solid solder ball, thereby reducing the level of stress imposed on the so...
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| Main Authors: | , , |
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| Format: | Default Conference proceeding |
| Published: |
2008
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/4217 |
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