Thermal and electrical modelling of polymer cored BGA interconnects

Polymer cored BGA/CSP balls have been proposed as a more reliable alternative to solid solder balls for demanding application environments. Their potential advantages are dependant on their increased compliance compared with a solid solder ball, thereby reducing the level of stress imposed on the so...

Full description

Bibliographic Details

Main Authors:	David Whalley, H. Kristiansen, F. Guillen Marin
Format:	Default Conference proceeding
Published:	2008
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/4217
Tags:	Add Tag No Tags, Be the first to tag this record!