Stability of Ni3P and its effect on the interfacial reaction between electroless Ni-P and molten tin

The stability of Ni3P and its effect on the reaction with molten tin were evaluated in the present study by comparing the reaction behaviour of Ni-P coatings in the as-plated and heat-treated conditions. It was found that after the solder reaction a dark layer of Ni3P was formed at the interface on...

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Bibliographic Details

Main Authors:	Keming Chen, Changqing Liu, David Whalley, David Hutt
Format:	Default Conference proceeding
Published:	2005
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/4185
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