A comparison of modelling methods for electronic interconnect structures
A comparison has been made between the use of 2-dimensional, axisymmetric and 3-dimensional geometry in the finite element analysis of a die attach assembly using conductive adhesives. The axisymmetric geometry was found to be a good approximation to the 3-dimensional geometry and gave considerable...
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| Main Authors: | , , |
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| Format: | Default Text |
| Published: |
1993
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/3975 |
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