An investigation into the effect of dry bake on the solderability degradation of electrodeposited tin finishes

The solderability of component termination finishes degrades upon storage due to the combined effects of surface contamination, oxidation, corrosion and/or intermetallic compound (IMC) formation at the interface between substrate and finishes. Such solderability degradation impinges on the shelf-lif...

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Bibliographic Details
Main Authors: Jing Wang, Guang Chen, Henry Forbes, Katerina Christopoulos, Changqing Liu, Liangquan Sun, Panju Shang
Format: Default Conference proceeding
Published: 2017
Subjects:
Mechanical engineering not elsewhere classified
Solderability
Preconditioning
Dry bake
Wetting Balance
Termination finishes
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/36281
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