TEM microstructural analysis of as-bonded copper ball bonds on aluminum metallization

In this study, the nano-scale interfacial details of ultrasonic copper ball bonding to an aluminum metallization in the as-bonded states were investigated using high resolution scanning/transmission electron microscopy with energy dispersive spectroscopy. Our results showed that ultrasonic vibration...

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Bibliographic Details

Main Authors:	Hui Xu, Changqing Liu, Vadim Silberschmidt, Zhong Chen
Format:	Default Conference proceeding
Published:	2008
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/5333
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