Characterization of printed solder paste excess and bridge related defects

Surface Mount Technology (SMT) involves the printing of solder paste on to printed circuit board (PCB) interconnection pads prior to component placement and reflow soldering. This paper focuses on the solder paste deposition process. With an approximated cause ratio of 50 – 70% of post assembly defe...

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Bibliographic Details

Main Authors:	Antony R. Wilson, Andrew West, Diana M. Segura-Velandia, Paul Conway, David Whalley, Lina A.M. Huertas-Quintero, Radmehr Monfared
Format:	Default Conference proceeding
Published:	2008
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/4221
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