Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnects

The control of the interfacial reaction rate is of great importance for liquid solder interconnects for high temperature electronic assemblies. Conventional electroless Ni-P barrier metallizations have been found to be inadequate for providing long term protection of the underlying metallization fro...

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Bibliographic Details

Main Authors:	Keming Chen, Changqing Liu, David Whalley, David Hutt, Jianfeng Li, Samjid H. Mannan
Format:	Default Conference proceeding
Published:	2006
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/4186
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