Creep analysis of a lead-free surface mount device

In this paper finite element analysis (FEA) is used to understand the effect of a non-uniform temperature distribution on the creep and fatigue behaviour of lead-free solder joints in an electronic assembly comprising of a chip resistor mounted on printed circuit board (PCB). Solder joints in surfac...

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Bibliographic Details
Main Authors: Pradeep Hegde, David Whalley, Vadim Silberschmidt
Format: Default Conference proceeding
Published: 2007
Subjects:
Mechanical engineering not elsewhere classified
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Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/5336
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https://hdl.handle.net/2134/5336

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