Creep analysis of a lead-free surface mount device

In this paper finite element analysis (FEA) is used to understand the effect of a non-uniform temperature distribution on the creep and fatigue behaviour of lead-free solder joints in an electronic assembly comprising of a chip resistor mounted on printed circuit board (PCB). Solder joints in surfac...

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Bibliographic Details

Main Authors:	Pradeep Hegde, David Whalley, Vadim Silberschmidt
Format:	Default Conference proceeding
Published:	2007
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/5336
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