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Thermal interface materials - a review of the state of the art
The past few decades have seen an escalation of power densities in electronic devices, and in particular in microprocessor chips. Together with the continuing trend of reduction in device dimensions this has led to dramatic increase in the thermal issues within electronic circuits. Thermal managemen...
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| Main Authors: | , , |
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| Format: | Default Conference proceeding |
| Published: |
2006
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/4197 |
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