The assessment of areal surface texture parameters for characterizing the adhesive bond strength of copper plated micro-machined glass.

The micro-electronics industry is investigating glass as an alternative printed circuit board material and interposer. Electroless copper plating of glass is required for tracks and interconnects, but understanding of how the surface topography of the glass substrate affects the mechanics of the cop...

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Bibliographic Details

Main Authors:	Baofeng He, Jon Petzing, Patrick Webb, Richard K. Leach, Paul Conway
Format:	Default Conference proceeding
Published:	2012
Subjects:	Mechanical engineering not elsewhere classified Glass Areal Surface Texture ISO 25178 Copper Plating Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/11561
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