Thermo-mechanical modelling of polymer encapsulated electronics

This paper reports on some initial results from a research project investigating a novel technology for the manufacture of recyclable polymeric modules with embedded electronic systems. The aim of this project is to develop a technology that fully encapsulates electronics for use in the demanding au...

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Bibliographic Details
Main Authors: Farhad Sarvar, Nee-Joo Teh, David Whalley, David Hutt, Paul Palmer
Format: Default Text
Published: 2004
Subjects:
Mechanical engineering not elsewhere classified
Polymer
Encapsulation
Injection moulding
Electronics
PCB
Overmoulding
Design-for-environment
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/3976
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