Influence of etching solvent evaporation on the size of micro-via holes in PVP thin films

Via holes are a necessary component in traditional PCBs and IC interconnections. Such structures will also be required in organic electronics to achieve vertical communication between multiple layers. Inkjet printing has demonstrated its applicability in both hole creation and for other pattern gene...

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Bibliographic Details
Main Authors: Yan Zhang, Changqing Liu, David C. Whalley
Format: Default Conference proceeding
Published: 2012
Subjects:
Mechanical engineering not elsewhere classified
Inkjet etching
Polymer etching
Via hole
Solvent evaporation
Coffee ring effect
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/11298
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