Thermal stress analysis of conductive adhesive joints

The effect of die geometry and the bond layer thickness on the stress distribution in a conductive die attach assembly was analysed using finite element models. Models used for the analysis were those of a freely deforming assembly i.e. not restrained by packaging. It was found that the thinner the...

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Bibliographic Details

Main Authors:	Adebayo Oluyinka Ogunjimi, David Whalley, David Williams
Format:	Default Article
Published:	1993
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/3982
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