Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activation

Electroless nickel bumping of aluminum (Al) bondpads followed by solder paste printing is seen as one of the lowest cost routes for the bumping of wafers prior to flip-chip assembly. However, the electroless nickel bumping of Al bondpads is not straightforward and a number of activation steps are ne...

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Bibliographic Details
Main Authors: David Hutt, Changqing Liu, Paul Conway, David Whalley, Samjid H. Mannan
Format: Default Article
Published: 2002
Subjects:
Mechanical engineering not elsewhere classified
Electroless Nickel
Flip-chip
Under Bump Metallization
Wafer Bumping
Zincate
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/3787
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https://hdl.handle.net/2134/3787

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