Computational modelling of the anisotropic conductive adhesive assembly process

Previously developed analytical models of the anisotropic adhesive assembly process have successfully predicted the time for adhesive resin flow out and whether this can be successfully achieved before resin cure. Computational Fluid Dynamics models have also provided significant insights into the e...

Full description

Bibliographic Details

Main Authors:	David Whalley, Greg Glinsky, Chris Bailey, Johan Liu
Format:	Default Text
Published:	2001
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/3980
Tags:	Add Tag No Tags, Be the first to tag this record!