Modeling of the power cycling performance of a Si on Si flip chip assembly

Flip Chip (FC) technology offers many advantages over conventional surface mount technology, including a smaller device footprint and higher interconnection density. Low power but complex consumer items, such as mobile telecommunications devices, utilise this packaging technology and it is likely to...

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Bibliographic Details
Main Authors: Andrew R. Ochana, David Hutt, David Whalley, Farhad Sarvar, A. Al-Habaibeh
Format: Default Conference proceeding
Published: 2006
Subjects:
Mechanical engineering not elsewhere classified
Flip chip
Finite element analysis
Power cycling
Multi-chip modules
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/4218
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