Laser processing of printed copper interconnects on polymer substrates

With the increasing demand for integration of electronics embedded within devices there has been a consequent increase in the requirement for the deposition of electrically conductive materials to form connecting tracks on or within non-traditional substrate materials, such as temperature sensitive...

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Bibliographic Details

Main Authors:	Kang Wu, Shuai Hou, Siyuan Qi, David Hutt, John Tyrer, David Whalley
Format:	Default Conference proceeding
Published:	2017
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/23575
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