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Laser processing of printed copper interconnects on polymer substrates
With the increasing demand for integration of electronics embedded within devices there has been a consequent increase in the requirement for the deposition of electrically conductive materials to form connecting tracks on or within non-traditional substrate materials, such as temperature sensitive...
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| Main Authors: | , , , , , |
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| Format: | Default Conference proceeding |
| Published: |
2017
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/23575 |
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