Under bump metallisation of fine pitch flip-chip using electroless nickel deposition

For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto the surface of the AI bondpads of the die is the first step in the wafer bumping process. The UBM is necessary, as the fragile AI pad has a tenacious oxide layer that cannot be soldered without the us...

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Bibliographic Details

Main Authors:	Changqing Liu, David Hutt, David Whalley, Paul Conway, Samjid H. Mannan
Format:	Default Text
Published:	2000
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/3931
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