Electrical conductive, characteristics of ACA bonding: a review of the literature, current challenges and future prospects.

Anisotropic Conductive Adhesives (ACAs) have been used in fine pitch electronics packaging for over a decade and provide a high density and low temperature bonding method in a range of niche applications. The principal objective of this paper is to provide significant insights into the basic conduct...

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Bibliographic Details

Main Authors:	Guangbin Dou, David C. Whalley, Changqing Liu
Format:	Default Conference proceeding
Published:	2004
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/4209
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