Degradation of adhesion strength within mini-modules during damp-heat exposure

The degradation of adhesion strength between back-sheet and encapsulant due to moisture ingress was investigated for commercial crystalline silicon photovoltaic (PV) mini-modules. The damp-heat test originated from qualification test was carried out at five different temperature and humidity conditi...

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Bibliographic Details
Main Authors: Dan Wu, Jiang Zhu, Thomas R. Betts, Ralph Gottschalg
Format: Default Conference proceeding
Published: 2013
Subjects:
Adhesion strength
Peel test
Damp heat
Adhesion degradation modelling
Online Access:https://hdl.handle.net/2134/13516
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https://hdl.handle.net/2134/13516

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