Degradation of adhesion strength within mini-modules during damp-heat exposure
The degradation of adhesion strength between back-sheet and encapsulant due to moisture ingress was investigated for commercial crystalline silicon photovoltaic (PV) mini-modules. The damp-heat test originated from qualification test was carried out at five different temperature and humidity conditi...
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| Main Authors: | , , , |
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| Format: | Default Conference proceeding |
| Published: |
2013
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/13516 |
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