APA (7th ed.) Citation

Wu, D., Zhu, J., Betts, T. R., & Gottschalg, R. (2013). Degradation of adhesion strength within mini-modules during damp-heat exposure.

Chicago Style (17th ed.) Citation

Wu, Dan, Jiang Zhu, Thomas R. Betts, and Ralph Gottschalg. Degradation of Adhesion Strength Within Mini-modules During Damp-heat Exposure. 2013.

MLA (9th ed.) Citation

Wu, Dan, et al. Degradation of Adhesion Strength Within Mini-modules During Damp-heat Exposure. 2013.

Warning: These citations may not always be 100% accurate.