Observations of solder paste reflow by means of electrical measurements
This paper presents a method for exploring the changes occurring at the surfaces of solder particles during the reflow soldering process. The method involves measuring changes in electrical resistance of a sample of paste as a function of test voltage. The results are used to estimate the size and n...
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| Main Authors: | , , , |
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| Format: | Default Text |
| Published: |
2000
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/3930 |
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