Effects of process parameters on bondability in thermosonic copper ball bonding

Thermosonic copper ball bonding is an absorbing interconnection technology that serves as a viable and cost saving alternative to gold ball bonding. Its excellent mechanical and electrical characteristics make copper ball bonding attractive for high-speed, power devices and fine-pitch applications....

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Bibliographic Details

Main Authors:	Hui Xu, Changqing Liu, Vadim Silberschmidt, Honghui Wang
Format:	Default Conference proceeding
Published:	2008
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/5337
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