APA (7th ed.) Citation

Xu, H., Liu, C., Silberschmidt, V., & Wang, H. (2008). Effects of process parameters on bondability in thermosonic copper ball bonding.

Chicago Style (17th ed.) Citation

Xu, Hui, Changqing Liu, Vadim Silberschmidt, and Honghui Wang. Effects of Process Parameters on Bondability in Thermosonic Copper Ball Bonding. 2008.

MLA (9th ed.) Citation

Xu, Hui, et al. Effects of Process Parameters on Bondability in Thermosonic Copper Ball Bonding. 2008.

Warning: These citations may not always be 100% accurate.