Investigation of a solder bumping technique for flip-chip interconnection

Investigation of a solder bumping technique for flip-chip interconnection

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Bibliographic Details
Main Authors: David Hutt, Daniel G. Rhodes, Paul Conway, Samjid H. Mannan, David Whalley
Format: Default Text
Published: 1999
Subjects:
Mechanical engineering not elsewhere classified
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Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/3927
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