Hutt, D., Rhodes, D. G., Conway, P., Mannan, S. H., & Whalley, D. (1999). Investigation of a solder bumping technique for flip-chip interconnection.
Chicago Style (17th ed.) CitationHutt, David, Daniel G. Rhodes, Paul Conway, Samjid H. Mannan, and David Whalley. Investigation of a Solder Bumping Technique for Flip-chip Interconnection. 1999.
MLA (9th ed.) CitationHutt, David, et al. Investigation of a Solder Bumping Technique for Flip-chip Interconnection. 1999.
Warning: These citations may not always be 100% accurate.