Solder paste reflow modeling for flip chip assembly

Solder paste printing and reflow can provide low cost techniques producing the solder bumps on flip chips. Solder paste consists of a dense suspension of solder particles in a fluid medium (vehicle) that acts as an oxide reducing agent (flux) during reflow, cleaning the metal surfaces of oxides. Thi...

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Bibliographic Details

Main Authors:	Samjid H. Mannan, D. Wheeler, David Hutt, David Whalley, Paul Conway, Chris Bailey
Format:	Default Text
Published:	2000
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/3926
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