Non-destructive defect detection for MEMS devices using transient thermography

This paper investigates the use of transient infrared thermography in a transmission mode for subsurface defect detection within thin multilayer structures such as those found in MEMS devices. This was undertaken through the use of finite element analysis based simulations for several sizes of defec...

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Bibliographic Details

Main Authors:	Xiaoting Wang, David Whalley, Vadim Silberschmidt
Format:	Default Conference proceeding
Published:	2016
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/33941
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