Modeling the electromigration failure time distribution in short copper interconnects

The electromigration EM lifetime in short copper interconnects is modeled using a previously developed means of generating realistic interconnect microstructures combined with the one-dimensional stress evolution equation of Korhonen et al. J. Appl. Phys. 73, 3790 1993 . This initial analysis descri...

Full description

Bibliographic Details

Main Author:	Vincent Dwyer
Format:	Default Article
Published:	2008
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/4986
Tags:	Add Tag No Tags, Be the first to tag this record!