Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part I - experiment

This paper presents new results from an experimental and theoretical program to evaluate relevant process parameters in the assembly of a 500 m pitch area array component using anisotropic conductive adhesive (ACA) materials. This experimental configuration has features of micro ball grid array ( BG...

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Bibliographic Details
Main Authors: Adebayo Oluyinka Ogunjimi, Samjid H. Mannan, David Whalley, David Williams
Format: Default Article
Published: 1996
Subjects:
Mechanical engineering not elsewhere classified
Anisotropic Conducting Adhesive
Flip-chip
Micro-electronics Assembly
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/3783
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https://hdl.handle.net/2134/3783

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