Experimental study of workpiece-level variability in blind-via electroplating

The acid copper electroplating process for the manufacture of printed wire boards was studied by statistical techniques. The objectives of this study were to investigate the effects of process and product parameters on the workpiece-level uniformity during the acid copper plating of blind vias and t...

Full description

Bibliographic Details

Main Authors:	G.K.K. Poon, J.S.F. Chan, David J. Williams
Format:	Default Article
Published:	2001
Subjects:	Mechanical engineering not elsewhere classified Blind vias Acid copper electroplating Statistical experimentation Variability control Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/4751
Tags:	Add Tag No Tags, Be the first to tag this record!