On the use of silver nanoparticles for direct micropatterning on polyimide substrates

This article proposes a direct micropatterning process based on the growth of photoreduced silver nanoparticles onto polyimide substrates. The silver nanoparticles are found to have sufficient catalytic efficiency for subsequent electroless plating. Characterization of the process indicates that UV...

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Bibliographic Details
Main Authors: Jack H.-G. Ng, David E.G. Watson, Joachim Sigwarth, Aongus McCarthy, Kevin A. Prior, Duncan P. Hand, Weixing Yu, Robert Kay, Changqing Liu, Marc P.Y. Desmulliez
Format: Default Article
Published: 2012
Subjects:
Mechanical engineering not elsewhere classified
Metallization
Photolithography
Polyimide
Silver nanoparticles
Flexible substrate
Direct writing
Micropatterning
Interconnections
Packaging
Electroless plating
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/13403
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