Creep damage study at powercycling of lead-free surface mount device

Soldering is extensively used to assemble electronic components to printed circuit boards or chips to a substrate in microelectronic devices. These solder joints serve as mechanical, thermal and electrical interconnections, therefore, their integrity is a key reliability concern. However, newly intr...

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Bibliographic Details

Main Authors:	Pradeep Hegde, David Whalley, Vadim Silberschmidt
Format:	Default Article
Published:	2009
Subjects:	Mechanical engineering not elsewhere classified Condensed matter physics not elsewhere classified Powercycling Lead-free solder Creep analysis Mechanical Engineering not elsewhere classified Condensed Matter Physics
Online Access:	https://hdl.handle.net/2134/4568
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