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Creep damage study at powercycling of lead-free surface mount device
Soldering is extensively used to assemble electronic components to printed circuit boards or chips to a substrate in microelectronic devices. These solder joints serve as mechanical, thermal and electrical interconnections, therefore, their integrity is a key reliability concern. However, newly intr...
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| Main Authors: | , , |
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| Format: | Default Article |
| Published: |
2009
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/4568 |
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