An investigation of electromigration induced void nucleation time statistics in short copper interconnects

The stress evolution model (SEM) of Korhonenet al., is used to calculate the void nucleation time in a large number of short interconnects lengths up to 50 um. Finite element calculations show that the effect of the nonlinearity in the SEM model is small, and that a mesh size of the order of the gra...

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Bibliographic Details

Main Author:	Vincent Dwyer
Format:	Default Article
Published:	2010
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/8330
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