Formation and homogenisation of Sn-Cu interconnects by self-propagated exothermic reactive bonding

We produced SnCu interconnects by self-propagated exothermic reactions using AlNi NanoFoil at ambient conditions, through the instantaneous localised heat across the interfaces between Sn electroplated Cu substrates. This technique presents a great potential for electronics integration with minimal...

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Bibliographic Details

Main Authors:	Wenbo Zhu, Xiaoting Wang, Changqing Liu, Zhaoxia Zhou, Fengshun Wu
Format:	Default Article
Published:	2019
Subjects:	Mechanical engineering not elsewhere classified SnCu interconnects Al-Ni NanoFoil Exothermic reactive bonding Non-equilibrium metastable phases Interfacial reactions Homogenisation Mechanical Engineering not elsewhere classified Mechanical Engineering
Online Access:	https://hdl.handle.net/2134/37573
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