Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel plating

Electroless nickel has been used for many decades to provide a hard, corrosion resistant surface finish to engineering components. In recent years its application has been extended to the electronics industry for the production of solderable surfaces on printed circuit boards, which utilize a furthe...

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Bibliographic Details
Main Authors: David Hutt, Changqing Liu, Paul Conway, David Whalley, Samjid H. Mannan
Format: Default Article
Published: 2002
Subjects:
Mechanical engineering not elsewhere classified
Electroless Nickel
Flip-chip
Under Bump Metalization
Wafer Bumping
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/3788
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https://hdl.handle.net/2134/3788

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