Conduction mechanisms in anisotropic conducting adhesive assembly

This paper explores both experimentally and through analytical and computational models, the mechanisms of conduction in flip-chip interconnections made using anisotropic conducting adhesives. A large number of assemblies have been constructed with geometries in the range of 200–500 m, and wide vari...

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Bibliographic Details

Main Authors:	Chucks N. Oguibe, Samjid H. Mannan, David Whalley, David Williams
Format:	Default Article
Published:	1998
Subjects:	Mechanical engineering not elsewhere classified ACA Adhesive Conductive Mechanisms Conductive Fillers Electric Contact Finite Element Method Ohmic Behavior Resistance Linearity Measurements Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/3786
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