Combining business process and failure modelling to increase yield in electronics manufacturing

The prediction and capturing of defects in low-volume assembly of electronics is a technical challenge that is a prerequisite for design for manufacturing (DfM) and business process improvement (BPI) to increase first-time yields and reduce production costs. Failures at the component-level (componen...

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Bibliographic Details

Main Authors:	Diana M. Segura-Velandia, Paul Conway, Radmehr Monfared, Andrew West
Format:	Default Article
Published:	2011
Subjects:	Mechanical engineering not elsewhere classified Business process improvement Business process modelling Cause and effect modelling Electronics assembly Yield Mechanical Engineering not elsewhere classified Mechanical Engineering
Online Access:	https://hdl.handle.net/2134/22149
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